High-density electronic head

Details High-density electronic head High-density electronic head

1994-07-05

1996-04-09

Wolff, John H.

Dynamic magnetic information storage or retrieval

Head

Plural gaps

360126, G11B 5147

Patent

active

055067379

ABSTRACT:
A VLSI-compatible process for the manufacturing of a monolithic high-density electronic head in the form of a single composite IC chip for reading and/or writing multiple tracks of magnetically recordable information. The VLSI-compatible process comprises the steps of fabricating a digital signal process circuit as well as other desired circuit components on a substrate, then fabricating a plurality of read and/or write elements on the same substrate using a thin film technique. Because the silicon-based materials, which are used to replace the conventional magneto-resistant elements, show very little magneto-resistance effect at room temperature, a magnetically sensitive layer is provided which comprises a double-drain polycrystalline thin-films transistor (DTFT) to provide the required sensitivity. Furthermore, because no wire-bonding is required between the write or read head and the necessary circuitry components, IC chips providing very high density monolithic electronic heads can be manufactured using the VLSI-compatible process, and each of the chips contains a very large number, in the order of several hundred, of read and/or write elements, as well as the necessary and/or desired electronic circuits. A plurality of read/write elements can be assigned to a common track of data to improve the accuracy and sensitivity of data transmission, or each element can be assigned to a respective track of data.

REFERENCES:
patent: 4373173 (1983-02-01), Robinson et al.
patent: 4418472 (1983-12-01), Lorenze, Jr.
patent: 4625250 (1986-11-01), Shibata
patent: 5224002 (1993-06-01), Nakashima
patent: 5237476 (1993-08-01), Bischoff et al.
patent: 5251088 (1993-10-01), Coutellier et al.

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