High density electronic circuit and process for making

Details High density electronic circuit and process for making High density electronic circuit and process for making

1996-09-18

1999-06-29

Niebling, John F.

Semiconductor device manufacturing: process

Thinning or removal of substrate

438117, 174267, 361764, H01L 21324, H01L 21477, H01L 2126, H01L 2142

Patent

active

059181532

ABSTRACT:
High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits. The posts also provide stress relief to accommodate differential thermal expansion. The process allows high interconnect density with fewer alignment restrictions and less wasted circuit area than previous processes. The resulting substrates can be test platforms for die testing and for multi-chip module substrate testing. The test platform can contain active components and emulate realistic operational conditions, replacing shorts/opens net testing.

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