High density electrical interconnection device and method theref

Details High density electrical interconnection device and method theref High density electrical interconnection device and method theref

1992-03-25

1994-01-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174257, 174260, 361386, 361397, 361416, 361417, 361718, 361748, 361805, 361807, 439 48, H05K 103, H05K 111

Patent

active

052787273

ABSTRACT:
A high density electrical interconnection device provides a uniform complementary pattern of thieving lines on both X and Y interconnect layers of the high density device to provide for uniform plating of the copper conductors, as well as reducing both nonuniformity and the amount of contraction and expansion of the insulating substrate. The complementary line pattern of thieving lines is generated by computer-aided design techniques and also includes provisions for gaps in thieving lines in one layer so as to eliminate crossover coupling with another layer and provides for visual identification of the thieving lines by the use of an undulating pattern.

REFERENCES:
patent: 3398232 (1968-08-01), Hoffman
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4654248 (1987-03-01), Mohammed
patent: 4899439 (1990-02-01), Potter et al.
patent: 4956749 (1990-09-01), Chang
patent: 4959900 (1990-10-01), de Givry et al.
IBM Technical Disclosure Bulletin by Dougherty vol. 19 No. 8 Jan. 1977.

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