High-density electrical contact pad pattern

Details High-density electrical contact pad pattern High-density electrical contact pad pattern

1983-06-29

1985-10-22

McQuade, John

Geometrical instruments

339 75MP, 339176MP, H01R 909

Patent

active

045484520

ABSTRACT:
A high-density printed circuit card electrical contact pad pattern that preserves card surface area while maintaining loose mechanical tolerance requirements and a high probability of contact. The invention exploits the elliptical shape of the area of high probability of contact between the contact pins of a mating connector and the card surface. The elliptical area is derived by an accumulation of mechanical tolerances associated with the card and with the pins of the mating connector. A plurality of rows of contacts are disposed along an edge of the card with each contact enclosing one elliptical area of high probability of contact. Each row is offset with respect, to, and slightly interleaved with adjacent rows.

REFERENCES:
patent: 3033914 (1962-05-01), Acosta-Lleras
patent: 3302067 (1967-01-01), Jackson et al.
patent: 3399372 (1968-08-01), Uberbacher
patent: 3703603 (1972-11-01), Levesoue et al.
patent: 4095866 (1978-06-01), Merrill
patent: 4298770 (1981-11-01), Nishihara et al.
patent: 4362899 (1972-12-01), Borrill
IBM Technical Disclosure Bulletin, vol. 13, No. 6, Nov. 1970, "High Density Circuits Connector" to S. M. Jensen, et al., pp. 1529-1530.

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