High density electrical connector having an alignment feature

Details High density electrical connector having an alignment feature High density electrical connector having an alignment feature

1997-03-13

1999-07-20

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

H01R 909

Patent

active

059248769

ABSTRACT:
The invention comprises an electrical connector having a housing with a plurality of contacts mounted therein. The contacts have connection sections and solder tails. The solder tails are aligned with each other and have contact surfaces. An alignment member has grooves therealong to receive the solder tails therein. The solder tails are secured within the grooves to ensure that the solder tails are properly aligned with each other.

REFERENCES:
patent: 4392705 (1983-07-01), Andrews, Jr. et al.
patent: 4618209 (1986-10-01), Sonobe
patent: 4734042 (1988-03-01), Martens et al.
patent: 4793816 (1988-12-01), Pittman et al.
patent: 4808115 (1989-02-01), Norton et al.
patent: 4857017 (1989-08-01), Erk
patent: 5090116 (1992-02-01), Henschen et al.
patent: 5133670 (1992-07-01), Doi et al.
patent: 5201664 (1993-04-01), Korsunsky et al.
patent: 5213514 (1993-05-01), Arai
patent: 5272807 (1993-12-01), Henschen et al.
patent: 5409384 (1995-04-01), Green et al.
U.S. Patent Application Serial No. 08/703,765, filed Aug. 27, 1996, abstract & drawings only.
Customer Drawing No. 447444 by AMP Incorporated.

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