Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1999-06-25
2001-06-05
Donovan, Lincoln (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S066000
Reexamination Certificate
active
06241532
ABSTRACT:
This invention pertains to electrical connector assemblies and, more particularly, to high density electrical connector assemblies.
Apparatus and methods for electrically connecting first and printed circuit boards, first and second flexible cables and a flexible cable to a printed circuit board have heretofore been provided. In one such apparatus and method for connecting a first printed circuit board to a second printed circuit board or a flexible cable, each of the traces of the first printed circuit board are electrically connected to a pin which extends through a corresponding bore in the second printed circuit board or flexible cable to electrically connect by soldering to a trace of the second printed circuit board or flexible cable. Unfortunately, the size of such pin connectors limit the density of electrical connections per unit area of the first printed circuit board. In addition, the pin connectors are easily damaged by bending or breaking and the printed circuit board itself is susceptible to damage during the soldering process. Furthermore, such soldering is not advantageous when a temporary electrical connection is desired.
In another such apparatus and method, a layer of a rubber material having a plurality of electrically conductive wire-like elements extending perpendicular to the first and second planar surfaces of the rubber layer is disposed between a plurality of first interconnect pads of a first printed circuit board and a plurality of second interconnect pads of a second printed circuit board arranged in a pattern corresponding to the first interconnect pads. In a similar apparatus, a matrix of small metal balls suspended in a layer of rubber is provided. A clamp sandwiches the rubber layer between the first and second printed circuit boards. The plurality of wire-like elements or stacking ball-type elements extending between a respective pair of first and second aligned interconnect pads serves to electrically connect such first and second interconnect pads. Unfortunately, the rubber layer requires that significant clamping forces be applied to the first and second printed circuit boards to ensure an electrical connection between the plurality of first and second interconnect pads.
In general, it is an object of the present invention to provide a high density electrical connector assembly that has a small footprint.
Another object of the invention is to provide a high density electrical connector assembly of the above character that does not utilize soldered connections.
Additional objects and features of the invention will appear from the following description from which the preferred embodiments are set forth in detail in conjunction with the accompanying drawings.
REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5795162 (1998-08-01), Lambert
Donovan Lincoln
Exatron, Inc.
Flehr Hohbach Test Albritton & Herbert LLP
Le Thanh-Tam
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