High density edgecard connector system

Details High density edgecard connector system High density edgecard connector system

Filed on

1988-02-29

Date issued

1989-02-21

Examiner

Weidenfeld, Gil

Patent Class

Electrical connectors

SubClass

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

SubSubClass

With mating connector which receives panel circuit edge

Other Related Categories

439630, 439636, 439637, H01R 909, H01R 2370

Type

Patent

Status

active

Patent number

048061034

Description

ABSTRACT:
A high density edgecard connector system includes a first row of cantilever contacts and a second row of cantilever contacts which are longer than those of the first row. The edgecard includes first and second rows of contact pads which are located differing distances from the bottom of the edgecard. Ribs are mounted on the edgecard between each of the contact pads in the first row and lift the cantilever contacts of the second row away from the surface of the edgecard in order to prevent cross connections between the cantilever contacts of the second row and the contact pads of the first row during insertion or withdrawal of the edgecard into or out of the connector. The ribs include ramps on either end and may be integrally molded with a spine which attaches to the bottom edge of the edgecard.

REFERENCES:
patent: 3160455 (1964-12-01), Mayor et al.
patent: 3744005 (1973-07-01), Sitzler
patent: 4548452 (1985-10-01), Gillett
patent: 4598966 (1986-07-01), Boland
patent: 4684194 (1987-08-01), Jenkins et al.
patent: 4705338 (1987-11-01), Sitzler
patent: 4720156 (1988-01-01), Beers

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