High density cross-connection system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361796, 361803, 361686, 439 59, 439 61, 439 62, 174261, H05K 114

Patent

active

06154373&

ABSTRACT:
Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.

REFERENCES:
patent: 4700274 (1987-10-01), Laut
patent: 5091822 (1992-02-01), Takashima
patent: 5119273 (1992-06-01), Corda
patent: 5122691 (1992-06-01), Balakrishnan
patent: 5130894 (1992-07-01), Miller
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5289340 (1994-02-01), Yoshifuji
patent: 5308926 (1994-05-01), Aurerbuch et al.
patent: 5317477 (1994-05-01), Gillett
patent: 5583867 (1996-12-01), Poole
patent: 5603044 (1997-02-01), Annapareddy et al.

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