High density corrugated wafer board panel product

Details High density corrugated wafer board panel product High density corrugated wafer board panel product

1989-01-03

1991-09-10

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Nonplanar uniform thickness material

428106, 428107, 428174, 428219, 428220, 428326, 4285371, 428541, 52795, 52814, B32B 328, E04C 232

Patent

active

050472801

ABSTRACT:
A `high density` corrugated wafer board panel is provided. The wafer board panel has a substantially uniform density ranging from between about 700 kg/m.sup.3 to 900 kg/m.sup.3. As a result of increasing the density of the panel without changing the panel weight per projected unit area, a panel having improved overall flexure performance properties is provided.

REFERENCES:
patent: 4232067 (1980-11-01), Coleman
patent: 4284676 (1981-08-01), Etzold
patent: 4372899 (1983-02-01), Wiemann et al.
patent: 4548851 (1985-10-01), Greer
patent: 4610900 (1986-09-01), Nishibori
patent: 4616991 (1986-10-01), Bach et al.
patent: 4675138 (1987-06-01), Bach et al.

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