Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-08-05
1991-01-29
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 74, 439 81, 439161, 439708, H01R 909, H01R 1320
Patent
active
049883054
ABSTRACT:
A connector is disclosed for coupling pins on a printed circuit board to respective mating pins on a gate-array or like plug-in device; the connector is characterized by "floating ring" engagers based within, and adapted to resiliently coupled a pair of such mating pins.
REFERENCES:
patent: 4505532 (1985-03-01), Hine et al.
patent: 4514784 (1985-04-01), Williams et al.
Harden; "Laminated Packet for Tunnel Diodes", IBM Tech. Disclosure Bulletin vol. 4, No. 5; Oct. 1961; p. 46.
Murphy Patrick J.
Svenkeson John W.
Bradley Paula A.
Unisys Corp.
LandOfFree
High density connectors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density connectors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density connectors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-810917