High density connector system

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge

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Details

439 66, 439630, H01R 909

Patent

active

052057380

ABSTRACT:
There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.

REFERENCES:
patent: 4249302 (1981-02-01), Crepeau
patent: 4421370 (1983-12-01), Treakle et al.
patent: 4707657 (1987-11-01), Bolgh-Petersen
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4820376 (1989-04-01), Lambert et al.
patent: 4927369 (1990-05-01), Grabbe et al.
patent: 5010389 (1991-04-01), Gansauge et al.
patent: 5040991 (1991-08-01), Collier
patent: 5137456 (1992-08-01), Desai et al.

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