Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1997-10-10
1999-11-02
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
174263, H01R 909
Patent
active
059759216
ABSTRACT:
An electrical connector illustrated as a plug and receptacle is disclosed. In one embodiment, the connector includes a base member having a plurality of bores. A first plurality of contact elements is positioned in certain of the bores. The tail portion of each contact element extends a distance beyond the base member. A second plurality of contact elements is positioned in others of the bores. Insertion of the tail portion of the second plurality of contact elements into a circuit board is sufficient to hold the tail portions of the first plurality of contact elements against the circuit board. It is preferred for the tail portions of the second plurality of contacts to be capable of axial movement when a compression force is applied. In another embodiment, the connector includes a frame and a layer of contact elements, wherein each of the contact elements includes a forward end and a tail portion. The ends of the tail portions are positioned proximate the bottom surface of the frame. A plurality of shaped fusible elements, for example, solder balls, are located proximate the ends of the tail portions. In such an embodiment, the solder balls preferably have a deformed spherical shape, wherein the aspect ratio is greater than one.
REFERENCES:
patent: Re32691 (1988-06-01), Dola et al.
patent: 4651055 (1987-03-01), Kuwamoto et al.
patent: 4678250 (1987-07-01), Romine et al.
patent: 4828503 (1989-05-01), Gilissen et al.
patent: 4846727 (1989-07-01), Glover et al.
patent: 4971565 (1990-11-01), Fox, Jr.
patent: 4975084 (1990-12-01), Fedder et al.
patent: 4978308 (1990-12-01), Kaufman
patent: 5046960 (1991-09-01), Fedder
patent: 5046966 (1991-09-01), Snyder et al.
patent: 5066236 (1991-11-01), Broeksteeg
patent: 5104341 (1992-04-01), Gilissen et al.
patent: 5162001 (1992-11-01), Harwath et al.
patent: 5174764 (1992-12-01), Kandybowski et al.
patent: 5178549 (1993-01-01), Neumann et al.
patent: 5213521 (1993-05-01), Arisaka
patent: 5261829 (1993-11-01), Fusselman et al.
patent: 5286212 (1994-02-01), Broeksteeg
patent: 5331514 (1994-07-01), Kuroda
patent: 5334031 (1994-08-01), Schmidt
patent: 5342211 (1994-08-01), Broeksteeg
patent: 5403206 (1995-04-01), McNamara et al.
patent: 5484310 (1996-01-01), McNamara et al.
patent: 5496183 (1996-03-01), Soes et al.
patent: 5538433 (1996-07-01), Arisaka
patent: 5562462 (1996-10-01), Matsuba et al.
patent: 5585162 (1996-12-01), Schueller
patent: 5605476 (1997-02-01), McNamara et al.
patent: 5607326 (1997-03-01), McNamara et al.
Berg Technology Inc.
Hamilla Brian J.
Long Daniel J.
Nguyen Khiem
Page M. Richard
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