Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-06-01
1991-10-15
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439457, 439493, H01R 909
Patent
active
050570234
ABSTRACT:
A connection system for use in connecting a high density flexible circuit directly to a surface mounted integrated circuit component mounted on a printed circuit board. The connection system utilizes an upper and lower stiffener plate to route the contacts of the high density flexible circuit to the pins of the integrated circuit component. The connection system utilizes silicone rubber pressure rods to create a force on the contacts of the higher density flexible circuit to ensure reliable connection to the leads of the surface mounted components. The connection system utilizes comb spacers which define slots to align the contacts of the high density circuit to the pins of the integrated circuit component and a top clamp to retain the assembly onto the integrated circuit component.
REFERENCES:
patent: 4917613 (1990-04-01), Kabadi
Flamm Ronald C.
Kabadi Ashok N.
Turner Leonard O.
Bradley Paula A.
Intel Corporation
LandOfFree
High density connector system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density connector system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density connector system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-987232