Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-05-11
1994-08-02
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 73, H01R 909
Patent
active
053340299
ABSTRACT:
Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.
REFERENCES:
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 4003621 (1977-01-01), Lamp
patent: 4514784 (1985-04-01), Williams et al.
patent: 4541882 (1985-09-01), Lassen
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4949455 (1990-08-01), Nakamura et al.
patent: 5045249 (1991-09-01), Jin et al.
patent: 5049982 (1991-09-01), Lee et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5154621 (1992-10-01), Legrady
patent: 5160268 (1992-11-01), Hakamian
patent: 5171290 (1992-12-01), Olla et al.
patent: 5174763 (1992-12-01), Wilson
patent: 5216807 (1993-06-01), Yoshizawa et al.
Akkapeddi Kaushik S.
Bonanni Rocco
Gashler Robert J.
German Michael G.
Lambert William R.
AT&T Bell Laboratories
Birnbaum Lester H.
Nguyen Khiem
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