Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-01-03
1990-11-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
29876, 439937, H01R 2372
Patent
active
049698265
ABSTRACT:
The present invention is an interposer connector assembly having a small contact grid spacing for interconnecting a relatively large integrated circuit chip carrier with a printed circuit board. The interposer connector assembly includes a holder which is composed of several thin plates having perforations arranged on the desired grid patterns. The thin plates are stacked with their perforations in alignment to form through openings in the holder. Contact modules are then inserted into the through openings to complete the connector assembly. The contact modules comprise a two part plastic housing with a contact member contained in a cavity formed by mating the two parts. The two parts are formed on continuous strips of extruded plastic.
REFERENCES:
patent: 4199209 (1980-04-01), Cherian et al.
patent: 4344662 (1982-08-01), Dalamangas
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4906194 (1990-03-01), Grabbe
IBM Bulletin, vol. 17, No. 2, page 444, Faure et al., 7-1974.
Abrams Neil
AMP Incorporated
Trygg James M.
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