Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1989-04-13
1990-03-06
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 66, 439608, H01R 2372
Patent
active
049061941
ABSTRACT:
A high density connector assembly for an IC chip carrier (10) includes a stack of spacer plated (30) having apertures (32) which form chambers for holding planar contact members (22) therein. The stack of spacer plates (30) are sandwiched between a lower reference plate (34) and an upper reference plate (36) which have precisely located apertures (42, 44) communicating with the chambers for precisely positioning contact portions (26, 28) of the contact members (22) with respect to contact pads (14, 18) on the IC chip module (10) and a printed circuit board (12). The plates (30, 34, 36) are preferably formed of a dielectric coated metal material to provide a ground shield around the contact members (22) to prevent cross talk therebetween.
REFERENCES:
patent: 4199209 (1980-04-01), Cherian et al.
patent: 4443756 (1984-04-01), Lightbody et al.
patent: 4699593 (1987-10-01), Gbabbe et al.
Abrams Neil
AMP Incorporated
Trygg James M.D.
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