High density connector assembly

Details High density connector assembly High density connector assembly

1994-10-18

1997-12-16

Bradley, P. Austin

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

H01R 909

Patent

active

056977948

ABSTRACT:
A connector assembly which includes a circuit board (18, FIG. 2 and 28, FIG. 3), a connector housing (40, 140), and a pair of flat flexible circuits (20, 22 and 30, 32). The flat flexible circuits have front end portions (50, 52 and 190, 192), where the circuit conductors form two spaced rows of connector contacts, and the circuits have stacked rear portions (60, 62 and 154, 156) where the conductors of the two flat flexible circuits are staggered and soldered to a single row of circuit board traces (80, FIG. 6).

REFERENCES:
patent: 3082398 (1963-03-01), Valach
patent: 3102767 (1963-09-01), Schneck
patent: 3154365 (1964-10-01), Crimmins
patent: 3319216 (1967-05-01), McCullough
patent: 3486159 (1969-12-01), Matthews
patent: 3614707 (1971-10-01), Kaufmann
patent: 3922054 (1975-11-01), Dechelette
patent: 4348071 (1982-09-01), Hsieh
patent: 4552420 (1985-11-01), Eigenbrode
patent: 4784615 (1988-11-01), Teng-Hong
patent: 4802866 (1989-02-01), Balzano et al.
patent: 4907975 (1990-03-01), Dranchak et al.
patent: 4911643 (1990-03-01), Perry et al.
patent: 5026291 (1991-06-01), David
patent: 5044980 (1991-09-01), Krumme et al.
patent: 5080595 (1992-01-01), Mouissie
patent: 5163835 (1992-11-01), Morlion et al.
patent: 5195897 (1993-03-01), Kent et al.
patent: 5297968 (1994-03-01), Johnson et al.
patent: 5316486 (1994-05-01), Tanaka et al.

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