High density connector and method therefor

Details High density connector and method therefor High density connector and method therefor

1998-05-29

1999-12-21

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Waveguide elements and components

333254, 385 54, H01P 104

Patent

active

060054581

ABSTRACT:
A method and apparatus for efficiently interconnecting a large number of high frequency high bandwidth signals includes two interface plates (100, 200), each having two substantially coplanar faces, a mating face (110, 210) and a non-mating face (120, 220). Each interface plate has waveguides (116, 216) disposed between the coplanar faces such that when the mating faces of the interface plates are brought together, a plurality of waveguide connections are made. An energy absorbing gasket (300) having a hole pattern matching the waveguide pattern is disposed between the mating faces of the interface plates so that reflections caused by misalignment and non-coplanarity of faces can be reduced.

REFERENCES:
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patent: 4279469 (1981-07-01), Forman
patent: 4341439 (1982-07-01), Hodge
patent: 4686498 (1987-08-01), Carr et al.
patent: 4701731 (1987-10-01), Hanson et al.
patent: 5297226 (1994-03-01), Fukunishi
patent: 5600336 (1997-02-01), Kubo et al.

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