High density connector

Details High density connector High density connector

2009-10-05

2010-11-02

Nasri, Javaid (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07824187

ABSTRACT:
An electrical connector system comprises a first PCB assembly (100) comprising a first PCB (10) and a first electrical connector (20) mounted on said first PCB (10) and a second PCB assembly (300) comprising a second PCB (30) perpendicular to the first PCB (10) and a second electrical connector (40) mounted on said second PCB (30). The first electrical connector (20) is formed with a port and the second electrical connector (40) is also formed with a port matable into the port of the first electrical connector (20), so that the first PCB assembly (100) is mountable to the second PCB assembly (300) along a first direction (120) parallel to the first PCB (10) and the second PCB (30).

REFERENCES:
patent: 6540522 (2003-04-01), Sipe
patent: 7322856 (2008-01-01), Laurx et al.
patent: 2005/0048838 (2005-03-01), Korsunsky et al.

Affiliated with

Also associated with

Rating

High density connector does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density connector will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4207907