High-density connector

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S579000, C439S607560

Reexamination Certificate

active

07470155

ABSTRACT:
A high-density connector assembly includes a frame, at least one sub-assembly connected to the frame, at least one connector connected to the at least one sub-assembly, a plurality of contacts disposed in the connector, a circuit board disposed in the connector; and a plurality of cables. Each of the plurality of cables is connected to a corresponding one of the plurality of contacts. At least one of the plurality of contacts has a bifurcated tip.

REFERENCES:
patent: 4913662 (1990-04-01), Noy
patent: 5411415 (1995-05-01), Embo et al.
patent: 5477518 (1995-12-01), Hiatt
patent: 6142835 (2000-11-01), Daoud
patent: 6857912 (2005-02-01), Wu
patent: 7101188 (2006-09-01), Summers et al.
patent: 7255578 (2007-08-01), Campini et al.
patent: 7445471 (2008-11-01), Scherer et al.
patent: 2004/0164754 (2004-08-01), Holcombe et al.
patent: 2005/0079772 (2005-04-01), DeLessert
patent: 2005/0122701 (2005-06-01), Coffey
patent: 2006/0223343 (2006-10-01), Campini et al.
Soubh et al.; “Probe Having a Filed-Replaceable Tip”; U.S. Appl. No. 11/668,455, filed Jan. 29, 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-density connector does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density connector will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4033226

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.