Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2006-08-29
2006-08-29
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C439S066000
Reexamination Certificate
active
07097470
ABSTRACT:
An improved and more flexible connector assembly and method are provided for connecting an electrical component to a substrate, such as a printed circuit board (PCB), by attaching an electrical component having ball or column grid array solder portions to corresponding electrical contact surfaces of a second connector half, mating first and second connector halves and attaching the first connector half having ball or column grid array solder portions to corresponding electrical contact surfaces of the substrate. The first and second connector halves may be electrically connected to each other via conventional mating techniques. When mated, electrical communication is achieved between corresponding portions of the first and second connector halves. Effects of CTE mismatch are minimized by providing the first and second connector halves between the electrical component and substrate.
REFERENCES:
patent: 4774632 (1988-09-01), Neugebauer
patent: 4975079 (1990-12-01), Beaman et al.
patent: 5137456 (1992-08-01), Desai et al.
patent: 5551627 (1996-09-01), Leicht et al.
patent: 5669774 (1997-09-01), Grabbe
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5730606 (1998-03-01), Sinclair
patent: 5746608 (1998-05-01), Taylor
patent: 5850693 (1998-12-01), Guran et al.
patent: 5872400 (1999-02-01), Chapman et al.
patent: 6042389 (2000-03-01), Lemke et al.
patent: 6069482 (2000-05-01), Hilton
patent: 6093042 (2000-07-01), Lemke et al.
patent: 6183268 (2001-02-01), Consoli et al.
patent: 6827586 (2004-12-01), Noda et al.
patent: 6866521 (2005-03-01), Harper, Jr.
patent: 2 293 502 (1996-03-01), None
patent: 7-312242 (1999-11-01), None
FCI Americas Technology Inc.
Girardi Vanessa
Ta Tho D.
Woodcock & Washburn LLP
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