High density connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439 67, 439 77, 439493, 439591, H01R 909

Patent

active

052482626

ABSTRACT:
An electrical connector for interconnecting a pair of circuit members (e.g., a circuit board and module), which, in one embodiment, includes a housing, at least one flexible circuit within the housing and a spring means attached to the flexible circuit at two spaced locations for exerting force against the flexible circuit to cause the circuit to engage respective conductive pads on the circuit members when the circuit members are moved toward each other (e.g., compressed). The shape of the spring means conforms substantially to the portion of the flexible circuit between the locations of attachment. In another embodiment, a connector for interconnecting such circuit members includes a housing adapted for being located between both members and at least one elongated, compressible contact member in the housing and including conductive end portions for engaging the circuit members. The contact occupies a first, prestressed position before engagement and is adapted for moving to a second, compressed position during the engagement. The conductive end portions of the flexible circuit in the first embodiment and the contact member in the second embodiment preferably comprise a plurality of dendrites for providing enhanced connections.

REFERENCES:
patent: 3679940 (1972-07-01), Newman et al.
patent: 3941442 (1976-10-01), Friend
patent: 3960423 (1976-06-01), Weisenburger
patent: 3960424 (1976-06-01), Weisenburger
patent: 4027935 (1977-06-01), Byrnes et al.
patent: 4295700 (1981-10-01), Sado
patent: 4505529 (1985-10-01), Barkus
patent: 4634199 (1987-01-01), Anhalt et al.
patent: 4636018 (1987-01-01), Stillie
patent: 4655519 (1987-04-01), Evans et al.
patent: 4764848 (1988-08-01), Simpson
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4818634 (1989-04-01), Bliss
patent: 4824391 (1989-04-01), Ii
patent: 4875863 (1989-10-01), Reed
patent: 4943242 (1990-07-01), Frankeny et al.
patent: 4998885 (1991-03-01), Beaman
patent: 4998886 (1991-03-01), Werner
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5049084 (1991-09-01), Bakke
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5102343 (1992-04-01), Knight et al.
patent: 5123849 (1992-06-01), Deak et al.
Research Disclosure, Jan. 1990, No. 309 (30964), "Dendrite Connectors For Low Temperature System Packaging".
Research Disclosure, Apr. 1991, No. 324 (32470), "Height Adjustable Disconnectable Electrical Mini Links".

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