High density connector

Details High density connector High density connector

1990-06-05

1991-10-08

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 74, 439289, 439331, H01R 909

Patent

active

050550543

ABSTRACT:
The present invention relates to electrical connectors for electrically connecting components and circuits on or in two parallel circuit boards and, more specifically, for electrically connecting components and circuits on or in two parallel circuit boards having a high density of interconnections.

REFERENCES:
patent: 3193793 (1965-07-01), Plunkett et al.
patent: 3951493 (1976-04-01), Kozel et al.
patent: 3960424 (1976-06-01), Weisenburger
patent: 4199209 (1980-04-01), Cherian et al.
patent: 4482937 (1984-11-01), Berg
patent: 4734060 (1988-03-01), Kawawada et al.
patent: 4752231 (1988-06-01), Olsson
patent: 4772211 (1988-09-01), Asick et al.
patent: 4813881 (1989-03-01), Kirby
patent: 4857001 (1989-08-01), Nakano et al.
patent: 4877409 (1989-10-01), Tanigawa et al.
patent: 4891019 (1990-01-01), Olsson
patent: 4909746 (1990-03-01), Scholz

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