High-density computer modules with double-layer packaging

Details High-density computer modules with double-layer packaging High-density computer modules with double-layer packaging

1998-04-04

2000-07-25

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361760, 361764, 361767, 361784, 257686, 257777, 257678, 257712, 257723, 257724, 174250, 174255, H05K 702

Patent

active

060943556

ABSTRACT:
An expansion module for mounting in an expansion slot of a computer includes a board with a plurality of apertures formed therein. Each aperture has a first chip package disposed substantially therein and a second chip package mounted to the board in a substantially spaced relationship to the first chip package. An interface is disposed on the board for engaging with the computer. By disposing one of the chip packages within the aperture and the other chip packaged in a spaced relationship therewith, the chip density may be essentially doubled over conventional boards.

REFERENCES:
patent: 5191404 (1993-03-01), Wu et al.
patent: 5412538 (1995-05-01), Kinnis et al.
patent: 5513135 (1996-04-01), Dell et al.
patent: 5652462 (1997-07-01), Matsunaga et al.
patent: 5661339 (1997-08-01), Clayton
patent: 5696395 (1997-12-01), Tseng
patent: 5708297 (1998-01-01), Clayton
patent: 5754408 (1998-05-01), Derouiche

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