Metal treatment – Compositions – Heat treating
Patent
1976-02-25
1977-03-22
Rutledge, L. Dewayne
Metal treatment
Compositions
Heat treating
148175, 148187, 357 48, H01L 21265
Patent
active
040134849
ABSTRACT:
A process for fabricating high density, high voltage CMOS devices. The process provides self-aligning, full channel stops which are formed prior to the fabrication of the active devices. The aligned full channel stops and a well are formed in the substrate without intermediate masking.
REFERENCES:
patent: 3702428 (1972-11-01), Schmitz et al.
patent: 3772097 (1973-11-01), Davis
patent: 3873383 (1975-03-01), Kooi
patent: 3912555 (1975-10-01), Tsuyuki
patent: 3933528 (1976-01-01), Sloan, Jr.
Boleky Edward J.
Scott Charles
Davis J. M.
Intel Corporation
Rutledge L. Dewayne
LandOfFree
High density CMOS process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density CMOS process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density CMOS process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1954616