High density CMOS integrated circuit with heat transfer structur

Details High density CMOS integrated circuit with heat transfer structur High density CMOS integrated circuit with heat transfer structur

1995-09-29

1997-04-15

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 257713, 257774, 257698, 361714, 361718, 361722, H05K 720

Patent

active

056216165

ABSTRACT:
A semiconductor integrated circuit includes a semiconductor circuit chip housed in a package. The package provides for electrical interface of the integrated circuit chip with external circuitry, and also provides environmental protection for the circuit chip. The circuit chip includes a circuit portion which liberates heat into the semiconductor substrate of the chip during operation of the integrated circuit. The integrated circuit chip also includes a layer of insulative material which overlies the semiconductor substrate. A thermally conductive plug member penetrates through the layer of insulative material and extends into a hole formed in the semiconductor substrate. This plug member is in conductive heat transfer relation with the material of the semiconductor substrate, and connects thermally with high-conductivity heat transfer structure conducting heat from the substrate to the package for liberation to the ambient.

REFERENCES:
patent: 4764804 (1988-08-01), Sahara et al.
patent: 5406120 (1995-04-01), Jones
Balderes et al "Heat Dissipation From IC Chips Through Module Package" IBM Tech Disc. Bulletin, vol. 19, No. 11, Apr. 1977, pp. 4165-4166.

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