High density circuit panel socket

Details High density circuit panel socket High density circuit panel socket

1987-01-27

1988-02-16

McGlynn, Joseph H.

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

H01R 1304

Patent

active

047252502

ABSTRACT:
A socket connector suitable for use in establishing interconnection to a plurality of closely spaced surface pad portions of traces on a circuit panel is disclosed. This socket connector is suitable for use with a high density single in-line memory module. The individual terminals are edge stamped from a spring metal blank and inserted in closely spaced centerlines and cavities in the housing. Insertion of a circuit panel edgewise into the connector biases the terminals outwardly with the stresses primarily confined to the plane of the spring metal blank. The terminals are inserted from above and positively retained within the housing. Low insertion forces, together with a wiping action between the terminals and the surface pad portions of traces on the circuit panel is achieved.

REFERENCES:
patent: 3366919 (1968-01-01), Gammel, Sr. et al.
patent: 3732531 (1973-05-01), Bouley
patent: 4072376 (1978-02-01), Shannon
patent: 4322120 (1982-03-01), Rilling
patent: 4557548 (1985-12-01), Thrush
patent: 4558912 (1985-12-01), Coller et al.
patent: 4575172 (1986-03-01), Walse et al.
patent: 4577922 (1986-03-01), Stipanuk et al.
U.S. Patent Application Ser. No. #800,181, filed Nov. 20, 1985.

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