High-density circuit module and method of producing the same

Details High-density circuit module and method of producing the same High-density circuit module and method of producing the same

1993-12-02

1996-09-17

Echols, P. W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361753, 174 524, 174 35R, 29831, H05K 900

Patent

active

055575080

ABSTRACT:
Single flat metal sheet blank in which thin metallic parts including side frames which are to form side walls, a shield plate and external lead and the like are connected together in a developed state in positional relationships necessary for the assembly of the high-density circuit module. A circuit board is then placed on one side of the shield plate of the flat metal sheet blank. Terminals having pedestals are formed on the shield plate. The terminals are inserted into holes formed in the circuit board and connected to conductors on the circuit board. Then, operations such as severance or bending are effected on selected connecting portions at which the thin metallic parts arranged in developed state are inter-connected, and required processings are executed on the portions to be jointed, whereby the circuit module is completed. According to this production method, a space for receiving circuit components is formed between the circuit board and the shield plate, so that both sides of the circuit board can be used for mounting the circuit components, whereby a high packaging density is attained.

REFERENCES:
patent: 5159537 (1992-10-01), Okano
patent: 5162971 (1992-11-01), Sato et al.
patent: 5365410 (1994-11-01), Lonka

Affiliated with

Also associated with

Rating

High-density circuit module and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density circuit module and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density circuit module and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-418394