High density circuit connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge

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Details

439637, H01R 2370

Patent

active

051978873

ABSTRACT:
An electronic connector is configured to removably receive either a circuit card of a first type, having one row of contacts per side, on an insertion tab adjacent to an insertion edge, or a circuit card of a second type, having two rows of contacts per side. Two rows of spring contacts are provided for this purpose on each side of a central card-receiving slot. Interposing means are also provided to prevent contact between a daughter card of the first type fully inserted in this slot and one of these rows on each side. These interposing means may consist of a slotted interposer structure slid over a portion of the insertion tab of the card, or alternately of a pair of pivotable interposers mounted along the length of the connector, to be pivoted by sections of daughter cards of the first type so that vanes extending from these interposers will push these springs away from the card.
An electronic device, such as a connector of this type, includes solder tails for attachment within holes of a mother board, aligned in several parallel rows. Individual solder tails in each row are displaced by a first distance. Individual solder tails in adjacent rows are displaced by a second distance, which is a submultiple of the first distance less than half the first distance. This second distance may also be a multiple of the first distance divided by the number of rows.

REFERENCES:
patent: 3868166 (1975-02-01), Ammon
patent: 3912353 (1975-10-01), Kasuya et al.
patent: 4077693 (1978-03-01), Briel, Jr. et al.
patent: 4080027 (1978-03-01), Benasutti
patent: 4257665 (1981-03-01), John et al.
patent: 4270826 (1981-06-01), Narozny
patent: 4288140 (1981-09-01), Griffith et al.
patent: 4298237 (1981-11-01), Griffith et al.
patent: 4314312 (1982-02-01), Donmoyer
patent: 4319102 (1982-03-01), Van Cleave et al.
patent: 4376565 (1983-03-01), Bird et al.
patent: 4479686 (1984-10-01), Hoshino et al.
patent: 4561710 (1985-12-01), Bovermann
patent: 4715820 (1987-12-01), Andrews, Jr. et al.
patent: 4734042 (1988-03-01), Martens et al.
patent: 4795374 (1989-01-01), Rishworth et al.
patent: 4806103 (1989-02-01), Kniese et al.
patent: 4824383 (1989-04-01), Lemke
patent: 4846734 (1989-07-01), Lytle et al.
patent: 4884975 (1989-12-01), Pelzl et al.
patent: 4885482 (1989-12-01), Sharp et al.
patent: 4891023 (1990-01-01), Lopata
patent: 4892487 (1990-01-01), Dranchak et al.
patent: 4904197 (1990-02-01), Cabourne
patent: 4932885 (1990-06-01), Scholz
patent: 4934961 (1990-06-01), Piorunneck et al.
patent: 5024609 (1991-06-01), Piorunneck
IBM Disclosure, Hinrichsmeyer, vol. 26, No. 12, p. 6476, May-1984.
Research Disclosure, Mason Publications, England, No. 28018, Aug.-1987.

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