High density circuit board chassis cooling system

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

165 803, 361415, H05K 720

Patent

active

052028160

ABSTRACT:
The present invention features a system for cooling a plurality of circuit boards in a high density chassis. The system includes a circuit board enclosure assembly having a number of slots for supporting a plurality of circuit boards. A filter is disposed beneath the circuit board enclosure assembly for filtering air flowing into the circuit board enclosure. The filter also creates air turbulence, and provides a pressure head adjacent the plurality of circuit boards. An air flow is generated by a dual cage type blower that is offset from the circuit board enclosure assembly. The air flow to the circuit boards is at sufficient air pressure and air flow rate to carry heat from the circuit boards. A multi-channel plenum disposed between the dual cage type blower and the circuit board enclosure assembly diffuses and directs the air flow to the circuit board enclosure assembly in a substantially flat profile. The multi-channel plenum individually distributes the air to each of said circuit boards in a substantially equal volume to ensure uniform cooling of each circuit board in the circuit board enclosure assembly, despite an absence of circuit boards in any one of the slots of the circuit board enclosure assembly.

REFERENCES:
patent: 2380026 (1945-07-01), Clarke
patent: 3771293 (1973-11-01), Vest
patent: 4233644 (1980-11-01), Hwang
patent: 4489363 (1984-12-01), Goldberg
patent: 4648007 (1987-03-01), Garner
patent: 4860163 (1989-08-01), Sarath
patent: 4911231 (1990-03-01), Horne
patent: 5027254 (1991-06-01), Corfits

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