High density circuit board and method of making same

Details High density circuit board and method of making same High density circuit board and method of making same

1990-08-01

1993-03-02

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361414, 29830, H05K 100

Patent

active

051911744

ABSTRACT:
A multilayered circuit board assembly which includes a plurality of layered subassemblies each having electrically conducting wiring and at least one through hole therein. A first of these subassemblies possesses a greater wiring dnesity than the others while a second subassembly possesses a lesser resistance (and wiring density) than the others. In one example, several (e.g. at least four) such layered subassemblies may be included in the overall assembly such that those layers located along one side of the board may possess substantially greater wiring densities than the layers on the other side of the board while those layers on said other side will in turn possess lesser resistance (and greater current capacities). There are also described at least three methods for making the above multilayered circuit board assembly. Such a structure may be utilized in supercomputer applications.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 3516156 (1970-06-01), Steranko
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4788766 (1988-12-01), Burger et al.
patent: 4803450 (1989-02-01), Burgess
patent: 4967314 (1990-10-01), Higgins, III
patent: 5012047 (1991-04-01), Dohya

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