High density circuit assembly

Details High density circuit assembly High density circuit assembly

1989-09-08

1990-11-20

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

361391, 361393, 361428, H02B 101

Patent

active

049722980

ABSTRACT:
A high density circuit computer assembly is provided by placing TCMs on a support board together with a printed circuit (PC) interconnect board, power supplies for TCMs to form a book package which, in turn, is slidably mounted on edge of the support board to a bookcase-like frame between shelves of the bookcase. The panel of connectors for the TCMs are placed on the support board at one end of the package to present a front connecting surface along the front face of the bookcase-like frame. A flexible multi-conductor board is coupled between the panel of connectors and the PC board. Multi-conductor cables extend along the front face and interconnect the connectors from one book package to another book package.

REFERENCES:
patent: 2880379 (1959-03-01), Stoddart et al.
patent: 3001102 (1961-09-01), Stiefel et al.
patent: 3476983 (1969-11-01), DeRobertis
patent: 3669279 (1972-06-01), Burgard et al.
patent: 3727168 (1973-04-01), Henschen et al.
patent: 3728662 (1973-04-01), Puri
patent: 3755630 (1973-08-01), Boyer
patent: 3812402 (1974-05-01), Garth
patent: 3954182 (1976-05-01), McEvers
patent: 3993936 (1976-11-01), Meade et al.
patent: 4002892 (1977-01-01), Zielinski
patent: 4039902 (1977-08-01), Lacan et al.
patent: 4145620 (1979-03-01), Dice
patent: 4179172 (1979-12-01), Godsey et al.
patent: 4197434 (1980-04-01), Inamasu et al.
patent: 4321654 (1982-06-01), Nakajo et al.
patent: 4337499 (1982-06-01), Cronin et al.
patent: 4470100 (1984-09-01), Rebaudo et al.
patent: 4498123 (1985-02-01), Fuss et al.
patent: 4509810 (1985-04-01), Erlam et al.
patent: 4574332 (1986-03-01), Calabro
patent: 4675538 (1987-06-01), Epstein
patent: 4683424 (1987-07-01), Cutright et al.
patent: 4695920 (1987-09-01), Klebba et al.
patent: 4716495 (1987-12-01), Craker
patent: 4730232 (1988-03-01), Lindberg
patent: 4748540 (1988-05-01), Henneberg et al.
patent: 4811165 (1989-03-01), Currier et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 7, 12/77, pp. 2524--Battiloro et al., "Modular Cable Distribution for Rack-Mounted Equipment".
IBM Technical Disclosure Bulletin, vol. 15, No. 11, 4/73, pp. 3408-3409, Atkinson et al., "Pluggable Storage Modules".
IBM Technical Disclosure Bulletin, vol. 13, No. 7, 12/70, pp. 2076 and 2077--Damari, "Electronic Page Assembly".

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