High density chip socket

Details High density chip socket High density chip socket

1985-01-30

1986-11-04

McQuade, John

Geometrical instruments

339 17CF, 339252S, H01R 909

Patent

active

046207619

ABSTRACT:
An interconnection system for high density I/O sites on an I.C. Interconnection substrate allowing field replacement thereof has a socket body with an array of contact springs adapted to be removably biased into engagement with conductive pads on the bottom surface of the substrate. The contact springs have a tail portion depending from the socket body which are affixed to a printed board. The substrate is locked into place on the socket body by removable latches.

REFERENCES:
patent: 3290636 (1966-12-01), Overtveld
patent: 4029375 (1977-06-01), Gabrielian
patent: 4130327 (1978-12-01), Spaulding
patent: 4330163 (1982-05-01), Aikens et al.
patent: 4378139 (1983-03-01), Griffin

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