High density chip carrier socket

Details High density chip carrier socket High density chip carrier socket

1989-08-11

1990-11-06

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

206331, 439892, H01R 2372

Patent

active

049682598

ABSTRACT:
Chip carrier sockets, for providing an electrical connection between a first electrical component and a second electrical component, have terminals provided therein, the terminals have contacting portions and retention portions provided thereon. The contacting portions are provided to electrically engage leads of a chip carrier with is positioned in a recess of the chip carrier socket. A spacer is provided between the contacting portions and the retention portions, such that the spacer has a greater width than the distance provided between the contacting portion and the retention portion, This spacing, in combination with a resilient member, insure that the spacer is resiliently forced against the contacting portion and the retention portion, thereby insuring that the first electrical component will be positioned and maintained in electrical engagement with the contact portion of the terminal.

REFERENCES:
patent: 3380016 (1968-04-01), Samson et al.
patent: 3796921 (1974-03-01), Fischer
patent: 4060296 (1977-11-01), Kunkle et al.
patent: 4872845 (1989-10-01), Korsunsky

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