High density board to board interconnection system

Details High density board to board interconnection system High density board to board interconnection system

1988-06-15

1989-06-13

Bradley, P. Austin

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

439493, H01R 909

Patent

active

048387983

ABSTRACT:
A high density interconnection system (2) is configured to provide a reliable interconnection between boards (4, 6). In order to accommodate space restrictions, the circuit boards (4, 6) are placed in a three-dimensional arrangement. The electrical interconnections between boards (4, 6) are provided by electrical connectors (10) rather than by a mother board. The use of electrical connectors (10) enables the signal paths length between the boards to be minimized, thereby allowing for high speed signal transmission.

REFERENCES:
patent: 4134631 (1979-01-01), Conrad et al.
patent: 4164362 (1979-08-01), Cobaugh et al.
patent: 4220382 (1980-09-01), Ritchie et al.
patent: 4337499 (1982-06-01), Cronin et al.
patent: 4401351 (1983-08-01), Record
patent: 4453309 (1984-06-01), Shirk
patent: 4498717 (1985-02-01), Reimer
patent: 4511950 (1985-04-01), Bunner et al.
patent: 4552420 (1985-11-01), Eigenbrode
patent: 4603928 (1986-08-01), Evans
patent: 4614389 (1986-09-01), Albert et al.
patent: 4693529 (1987-09-01), Stillie
patent: 4708660 (1987-11-01), Claeys et al.
patent: 4733461 (1988-03-01), Nakano
Article Entitled "A New Three-Dimensional Packaging Architecture . . . Topology".
Article Entitled "Topological Aspects of Systems Partioning".
Amp Pub P-188-77 Entitled "Intercard Conn. W/O Backplanes".

Affiliated with

Also associated with

Rating

High density board to board interconnection system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density board to board interconnection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density board to board interconnection system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1273617