High density backplane connector

Details High density backplane connector High density backplane connector

1991-11-06

1992-12-15

Schwartz, Larry I.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 62, 439260, 439465, 439493, 439637, H01R 909

Patent

active

051711540

ABSTRACT:
A high density connector (10) for electrically interconnecting conductive paths (14, 84) on close centers between circuit boards such as those of a backpanel (82) and daughter cards (12), includes a clamping mechanism (18, 20) bolted first to a daughter card and then to a backpanel to compress springs (46, 48, 50) held by the mechanism driving flat flexible circuits (52) having contacts (68, 70) on close centers to engage board circuit paths, where the mechanism (18, 20) is rigid and includes spring driven clamps (42) to straighten the daughter card and strain relief the interconnection area. The flexible circuit contacts (68, 70) are offset relative to the springs (48, 50) bearing area to provide a contact wipe of the contact path interconnection.

REFERENCES:
patent: 3609463 (1971-09-01), Laboue
patent: 4087148 (1978-05-01), Bauerle
patent: 4552420 (1985-11-01), Eigenbrode
patent: 4776805 (1988-10-01), Brown et al.
patent: 4907975 (1990-03-01), Dranchak et al.
patent: 4969824 (1990-11-01), Casciotti
patent: 5092781 (1992-03-01), Casciotti et al.
patent: 5098309 (1992-03-01), Deak et al.

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