Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-09-20
1989-11-21
Bradley, P. Austin
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 67, 439260, 439629, H01R 909, H01R 2370
Patent
active
048819018
ABSTRACT:
A high density backplane (HDB) connector is provided for electrically interconnecting high density printed circuit boards. The printed circuit boards have a predetermined geometric conductive pattern which includes high density arrays of individual signal/power contact interconnects and unitary ground strips. The HDB connector comprises a housing module secured to one board and a stiffener module secured to a second board. A compliant contact module mounted within the housing module includes a resilient member, an insulator member having arrays of free-floating rigid contact pins disposed therein, and a flexile film interposed therebetween. The flexile film has a signal/power conductive matrix formed on one side and a continuous ground plane formed on the other side. The compliant contact module further includes prestressed early-mate ground contacts and a plurality of distributed resilient ground contacts. Circuit board mating is effected by pressing the stiffener module down onto the housing module. The prestressed early-mate ground contacts exert forces to bias the second board away from the rigid contact pins. Further downward movement of the stiffener module causes a camming coaction between the stiffener module and the housing module to urge the second board into mating engagement with the rigid contact pins and the distributed resilient ground contacts. Final downward movement of the stiffener effects a wiping action between contact interconnects.
REFERENCES:
patent: 3715706 (1973-02-01), Michel et al.
patent: 3853382 (1974-12-01), Lazar
patent: 4288140 (1981-09-01), Griffith et al.
patent: 4420203 (1983-12-01), Aug et al.
patent: 4517625 (1985-05-01), Frink et al.
patent: 4518210 (1985-05-01), Morrison
patent: 4538866 (1985-09-01), Johnson
patent: 4540227 (1985-09-01), Faraci
patent: 4540228 (1985-09-01), Steele
patent: 4585288 (1986-04-01), Aikens
patent: 4597619 (1986-07-01), Reimer
patent: 4629270 (1986-12-01), Andrews, Jr. et al.
patent: 4693529 (1987-09-01), Stillie
patent: 4744764 (1988-05-01), Rubenstein
Corbesero Steve R.
Cotter Neil J.
Goff Jay T.
Marian Steve P.
Mendenhall David W.
Augat Inc.
Bradley P. Austin
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