High density array of optical transceiver modules

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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Details

C385S092000, C385S088000, C385S053000, C385S052000, C385S014000, C398S164000, C398S135000

Reexamination Certificate

active

07455463

ABSTRACT:
Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.

REFERENCES:
patent: 5047835 (1991-09-01), Chang
patent: 5280191 (1994-01-01), Chang
patent: 7215889 (2007-05-01), Light
patent: 2003/0228799 (2003-12-01), Machado et al.
patent: 2005/0271391 (2005-12-01), Togami et al.
patent: 2005/0286906 (2005-12-01), Togami et al.
patent: 2006/0153507 (2006-07-01), Togami et al.

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