High density, area array probe card apparatus

Details High density, area array probe card apparatus High density, area array probe card apparatus

2005-06-14

2005-06-14

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090

Reexamination Certificate

active

06906539

ABSTRACT:
A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.

REFERENCES:
patent: 4885126 (1989-12-01), Polonio

Affiliated with

Also associated with

Rating

High density, area array probe card apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density, area array probe card apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density, area array probe card apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3478757