High-density architecture for a microelectronic complex on a...

Details High-density architecture for a microelectronic complex on a... High-density architecture for a microelectronic complex on a...

2006-06-27

2006-06-27

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S712000, C257S713000, C361S708000, C361S710000, C361S719000

Reexamination Certificate

active

07068511

ABSTRACT:
A microelectronic complex including a first body, a discrete functional module and an interconnection module. The first body is characterized by a planar main surface that defines an attachment site. The discrete functional module includes a second body containing an integrated circuit, the second body characterized by a pair of main faces and a side surface between the pair of main faces. The discrete functional module is affixed to the first body at the attachment site, such that the first and second bodies are maintained in a predetermined spatial relationship in which the side surface of the second body faces the planar main surface of the first body. The interconnection module allows signals to be transported between the first body and the integrated circuit of the second body.

REFERENCES:
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patent: 5691949 (1997-11-01), Hively et al.
patent: 5726492 (1998-03-01), Suzuki et al.
patent: 6184066 (2001-02-01), Chino et al.

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