High density and high programming efficiency MRAM design

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S295000, C257SE27006

Reexamination Certificate

active

06864551

ABSTRACT:
A method and system for providing a magnetic memory is disclosed. The magnetic memory includes a magnetic element. The magnetic element is written using a first write line and a second write line and resides at an intersection between the first and second write lines. The second write line is oriented at an angle to the first write line. The second write line has a top and at least one side. At least a portion of the second write line is covered by an insulating layer. A magnetic layer covers a portion of the insulating layer. The portion of the insulating layer resides between the magnetic layer and the second write line. The magnetic layer includes a soft magnetic material.

REFERENCES:
patent: 5659499 (1997-08-01), Chen et al.
patent: 5940319 (1999-08-01), Durlam et al.
patent: 5956267 (1999-09-01), Hurst et al.
patent: 6153443 (2000-11-01), Durlam et al.
patent: 6211090 (2001-04-01), Durlam et al.
patent: 6335890 (2002-01-01), Reohr et al.
patent: 20020034117 (2002-03-01), Okazawa
patent: 20020080643 (2002-06-01), Ito
patent: 20020127743 (2002-09-01), Nickel et al.
patent: 20040075125 (2004-04-01), Asao

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High density and high programming efficiency MRAM design does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density and high programming efficiency MRAM design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density and high programming efficiency MRAM design will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3396222

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.