High density and high current capacity pad-to-pad connector comp

Details High density and high current capacity pad-to-pad connector comp High density and high current capacity pad-to-pad connector comp

1994-12-14

1997-03-18

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 71, H01R 909

Patent

active

056116969

ABSTRACT:
A new approach to providing thousands of contacts between electronic packages and their next package level by use of small formed spring contact elements (SCE) retained within a interposer structure or soldered directly into a printed circuit board or onto the module is disclosed. Each contact element can be either a signal or power line and, for improved electrical performance, alternate both horizontally and vertically in an orthogonal grid such that no signalling is adjacent to another signal. The spring contact elements (SCE) have multiple cross-sectional shapes and are pre-formed for improved mechanical performance. A retainer contains the multiplicity of SCE while providing a air plenum for improved thermal performance.

REFERENCES:
patent: 3921285 (1975-11-01), Krall
patent: 4764848 (1988-08-01), Simpson
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5123848 (1992-06-01), August et al.
patent: 5248262 (1993-09-01), Busacco et al.

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