High density air cooled wafer package having improved thermal di

Details High density air cooled wafer package having improved thermal di High density air cooled wafer package having improved thermal di

1975-03-31

1976-12-28

Wojciechowicz, Edward J.

357 74, 357 79, 357 80, 357 82, H01L 2302, H01L 2342, H01L 3902, H01L 2504

Patent

active

040005097

ABSTRACT:
A high density low profile air cooled wafer package including flip chip and embedded logic or memory islands upon a wafer package mounted within a heat dissipating cover having improved thermal dissipation. Heat dissipation is achieved through a thermal grease interface provided between the wafer carrier and the heatsink cover, with pressure being applied to the interface by partially deflected electrical connectors secured there between.

REFERENCES:
patent: 3365620 (1968-01-01), Butler et al.
patent: 3741292 (1973-06-01), Kumar et al.
patent: 3805123 (1974-04-01), Rieger
patent: 3846824 (1974-11-01), Bell

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