High current interconnect structure for IC memory device...

Static information storage and retrieval – Interconnection arrangements – Magnetic

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C365S158000

Reexamination Certificate

active

07471539

ABSTRACT:
A method and system for a high current semiconductor memory cell provides a semiconductor memory cell with two current carrying structures. At least one of the current carrying structures is segmented and formed of narrow wire segments from one or more levels coupled to wider connective squares of another level. The wire segments may be a conductive material and the connective squares a refractory material. The short length wire segments may include a length less than the average grain size of the material of which they are formed.

REFERENCES:
patent: 6424561 (2002-07-01), Li et al.
patent: 6909629 (2005-06-01), Theel
patent: 6940749 (2005-09-01), Tsang
patent: 7020004 (2006-03-01), Hurst et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High current interconnect structure for IC memory device... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High current interconnect structure for IC memory device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High current interconnect structure for IC memory device... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4034254

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.