High current density continuous wire plating cell

Details High current density continuous wire plating cell High current density continuous wire plating cell

1989-11-06

1993-01-05

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204239, 204275, 204279, 204284, 204292, C25D 706, C25D 1700

Patent

active

051768089

ABSTRACT:
A wire plating cell comprises an enclosed housing into which plating solution is pumped at a high velocity so as to create substantial fluid pressure therein. The plating cell contains a plurality of consumable anodes through which a wire passes axially and through which plating solution flows transversely. Current densities of at least 200 amps per square foot are obtained. Use of a highly concentrated plating solution in the cell results in high-speed, high quality wire plating. The invention particularly applies to the plating of nickel onto steel wire at current densities of up to 14,500 amps per square foot.

REFERENCES:
patent: 3549507 (1970-12-01), Semienko et al.
patent: 3894924 (1975-07-01), Toledo
patent: 3994786 (1976-11-01), Marks et al.
patent: 4769114 (1988-09-01), Podrini
Avila et al., "Methods of and Apparatus for Treating Articles", U.S. Def. Publication No. 667,231, Nov. 18, 1969.

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