High conductivity inks with low minimum curing temperatures

Details High conductivity inks with low minimum curing temperatures High conductivity inks with low minimum curing temperatures

2006-11-28

2006-11-28

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S500000, C252S511000, C252S512000, C106S001130, C106S001150, C106S001190, C427S216000, C427S220000, C427S596000, C430S108300, C430S119880, C156S230000, C156S233000, C075S255000, C524S439000

Reexamination Certificate

active

07141185

ABSTRACT:
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.

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