High conductivity inks with improved adhesion

Details High conductivity inks with improved adhesion High conductivity inks with improved adhesion

2007-05-01

2007-05-01

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C250S503100, C250S518100, C250S518100, C250S519100, C106S001130, C106S001150, C106S001190, C427S096400, C427S294000, C427S553000, C430S115000, C430S270100

Reexamination Certificate

active

10353837

ABSTRACT:
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

REFERENCES:
patent: 3454518 (1969-07-01), Bernard
patent: 4186244 (1980-01-01), Deffeyes et al.
patent: 4289534 (1981-09-01), Deffeyes et al.
patent: 4371459 (1983-02-01), Nazarenko
patent: 4499010 (1985-02-01), Tanino et al.
patent: 4921623 (1990-05-01), Yamaguchi et al.
patent: 4950423 (1990-08-01), Sullivan
patent: 4981730 (1991-01-01), Zaleski
patent: 5011758 (1991-04-01), Detig et al.
patent: 5286415 (1994-02-01), Buckley et al.
patent: 5376403 (1994-12-01), Capote et al.
patent: 5814248 (1998-09-01), Tani et al.
patent: 5830389 (1998-11-01), Capote et al.
patent: 5853622 (1998-12-01), Gallagher et al.
patent: 5882722 (1999-03-01), Kydd
patent: 5985043 (1999-11-01), Zhou et al.
patent: 5985456 (1999-11-01), Zhou et al.
patent: 6017634 (2000-01-01), Capote et al.
patent: 6036889 (2000-03-01), Kydd
patent: 6143356 (2000-11-01), Jablonski
patent: 6153348 (2000-11-01), Kydd et al.
patent: 6156237 (2000-12-01), Kubota et al.
patent: 6214527 (2001-04-01), Kosaka et al.
patent: 6274412 (2001-08-01), Kydd et al.
patent: 6322620 (2001-11-01), Xiao
patent: 6372158 (2002-04-01), Hashimoto et al.
patent: 6379745 (2002-04-01), Kydd et al.
patent: 6743319 (2004-06-01), Kydd
patent: 7014885 (2006-03-01), Piqué et al.
patent: 2001/0046562 (2001-11-01), Whitefield et al.
patent: 2002/0195934 (2002-12-01), Bush et al.
patent: 05-054716 (1993-03-01), None
patent: 08283517 (1996-10-01), None
patent: 63-278983 (1998-11-01), None
patent: WO 99/16556 (1999-04-01), None
patent: WO 99/16601 (1999-04-01), None
patent: WO 99/17352 (1999-04-01), None
patent: WO 99/45077 (1999-09-01), None
patent: WO 00/29208 (2000-05-01), None
patent: WO 01/45935 (2001-06-01), None
patent: WO 01/82315 (2001-11-01), None
patent: WO 01/87503 (2001-11-01), None
Data Sheet-silver Oxalate, 2000.

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