Heat exchange – Heat transmitter
Patent
1988-05-26
1991-10-01
Schwadron, Martin P.
Heat exchange
Heat transmitter
165 802, 357 81, 361386, F28F 700
Patent
active
050524810
ABSTRACT:
The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device having a flat bottom contacts the chips, while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components. The present high conduction cooling module allows for the simple incorporation of side biasing means and a grooved chip interface on the finned internal thermal devices to provide enhanced thermal performance if required.
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IBM TDB, vol. 26, No. 9, Feb. 1984, "High Performance Chip-Cooling Technique for Cold Plate or External Air-Cooled Modules" J. K. Hassan et al., pp. 4658-4660.
K. C. Norris & A. H. Landzberg, "Reliability of Controlled Collapse Interconnections" IBM Journal of Research and Development, vol. 13, No. 3, pp. 266-271.
Biskeborn Robert G.
Harvilchuck Joseph M.
Horvath Joseph L.
Ahsan Aziz M.
Flanigan Allen J.
International Business Machines - Corporation
Meyers Steven J.
Schwadron Martin P.
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