Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate
Reexamination Certificate
2007-03-20
2007-03-20
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
Clay, silica, or silicate
C106S003000, C106S482000, C438S692000, C438S693000, C516S034000, C423S335000, C423S336000, C423S337000, C423S338000, C423S339000
Reexamination Certificate
active
10718573
ABSTRACT:
A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa·s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 μm to 0.8 μm.
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Brandl Paul
Morii Toshio
Marcheschi Michael
Nippon Aerosil Co., Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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