High chloride (100) tabular grain emulsions containing large, th

Details High chloride (100) tabular grain emulsions containing large, th High chloride (100) tabular grain emulsions containing large, th

1996-02-20

1997-09-02

Huff, Mark F.

Radiation imagery chemistry: process, composition, or product th

Radiation sensitive product

Silver compound sensitizer containing

430567, G03C 1035, G03C 1015

Patent

active

056630417

ABSTRACT:
A radiation-sensitive emulsion is disclosed in which greater than 50 percent of total grain projected area is accounted for by tabular grains (a) having {100} major faces, (b) containing greater than 50 mole percent chloride, based on silver, (c) having a mean equivalent circular diameter in the range of from 2.0 to 5.0 .mu.m, and (d) exhibiting a mean thickness of 0.1 .mu.m or less.
The emulsion is prepared by (a) precipitating up to 10 percent of the total silver forming the high chloride {100} tabular grains to create a first grain population under conditions that form a crystal lattice structure that favors the growth of high chloride {100} tabular grains, (b) thereafter rapidly introducing silver and halide ions to create a second grain population, and (c) growing the first grain population to create the high chloride {100} tabular grains by ripening out the second grain population.

REFERENCES:
patent: 5238805 (1993-08-01), Saitou
patent: 5254454 (1993-10-01), Mimiya et al.
patent: 5292632 (1994-03-01), Maskasky
patent: 5314798 (1994-05-01), Brust et al.
patent: 5320938 (1994-06-01), House et al.

Affiliated with

Also associated with

Rating

High chloride (100) tabular grain emulsions containing large, th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High chloride (100) tabular grain emulsions containing large, th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High chloride (100) tabular grain emulsions containing large, th will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-307211